Thermal Management of 3D IC Chips

A three-dimensional integrated circuit (3D IC), often referred to as a 3D chip, is an advanced semiconductor technology that vertically stacks multiple layers of integrated circuits on top of each other, as opposed to traditional two-dimensional (2D) chips where components are laid out horizontally on a single plane. This stacking allows for increased functionality and performance within a smaller footprint, making 3D ICs a crucial innovation in modern electronics.

The 3D IC is one of several 3D integration schemes that can exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. However, thermal management issues in 3D devices and systems remain a problem.

Our patented approach solves these thermal management issues through the design and optimization of insert structures embedded in the heat spreader of a 3D IC. The inserts can be distributed in a blade type arrangement configured in three possible architectures: radial, one level of pairing, and two levels of pairing.