Thermal management is a key issue in developing future generations of integrated systems as chip densities and clock speeds continuously increase. Thermal management of 3D IC is even more challenging due to the higher power density and lower surface-to-volume ratio of 3D IC chip structures. Our patented designs include ring type and blade type configurations for heat sinks that improve the cooling capability of 3D integrated circuit chips.

Magnetothermal stimulation, a promising alternative, utilizes nano-transducers to convert magnetic field energy into heat, activating targeted neurons. Test results have shown promising symptom improvement. To enhance the approach, we've developed an innovative optimization technique that minimizes any potential adverse impacts associated with magnetothermal stimulation.

Dissipation of heat created in electronic components has always been a challenge. As electronic devices get more compact and powerful, the need for effective thermal management systems becomes even more crucial.

We have filed patent applications covering innovative heat sink designs including Microchannel Heat Sinks (MCHS) and Flat Plate Micro Heat Pipes (FPM-HP) to improve thermal management in electronic components.