Electronics Cooling

Managing heat dissipation in electronic components poses an ongoing challenge. As electronic devices become more compact and powerful, the demand for efficient thermal management systems becomes increasingly critical. Without effective thermal management, the heat generated by these devices can lead to substantial temperature increases, affecting performance and reliability.

To ensure optimal functionality, it is crucial to efficiently remove generated heat with minimal temperature rise and maintain a uniform temperature distribution within electronic components. Our approach to electronics cooling solutions incorporates innovative heat sink designs, including Microchannel Heat Sinks (MCHS) and Flat Plate Micro Heat Pipes (FPM-HP), aimed at enhancing thermal management in electronic components.

We employ the three-dimensional finite volume method to analyze fluid flow and heat transfer in these heat sinks. The validity of our numerical models has been confirmed through comparison with relevant experimental data. This comprehensive approach aims to address the evolving thermal challenges associated with modern electronic devices.