Patent Application Recognized for Innovations in 3D IC Device Thermal Solutions
Patent Allowed by USPTO for Thermal Management of 3D IC Chips
Enhancing 3D Integrated Circuit Cooling with Boron Arsenide Insert Structures
Cooling of 3D IC Chips
Unlocking the Potential: Exploring the Advantages of Circular 3D IC Chips
Circular 3D ICs are poised to redefine the landscape of semiconductor technology. With advantages ranging from enhanced performance and integration density to efficient thermal management and power savings, these chiplets hold the key to unlocking new possibilities in electronic device design.
Efficient Thermal Harmony: The Advantages of Ring-Shaped Heat Sinks for 3D IC Chips
The Advantages of Ring-Shaped Heat Sinks for 3D IC Chips