Patent Application Recognized for Innovations in 3D IC Device Thermal Solutions
Kambix Innovations, LLC announces the allowance of U.S. Patent Application No. 17/401,676, marking a significant milestone in the field of thermal management for three-dimensional integrated circuits (3D ICs). This patent, part of a growing portfolio dedicated to advancements in thermal management of 3D IC chips, underscores Kambix Innovations' commitment to addressing the critical need for efficient thermal solutions in the evolving landscape of microelectronic components.
Key Features of U.S. Patent Application No. 17/401,676: The patent covers a 3D IC device featuring a substrate, an electronic device configured above the substrate, and a heat spreader located proximate to the electronic device. Notably, the heat spreader comprises inserts arranged in a ring configuration, with the inserts exhibiting a geometry that is both ring-shaped and blade-shaped, subject to one or more levels of pairing. Additionally, a heat sink can be positioned above and adjacent to the heat spreader.
Innovative Solutions for Thermal Management: As electronic components, particularly 3D IC chips, become more intricate with an increasing number of devices mounted on a single chip, effective thermal management becomes paramount. Thermal issues have a profound impact on the functionality and reliability of electronic systems. U.S. Patent Application No. 17/401,676, and its continuing applications, offer groundbreaking thermal solutions specifically tailored for 3D IC chips.
Significance for Emerging Technologies: This patent is particularly relevant to newer IC chips, including AI processors and other advanced electronic components, where efficient thermal management is crucial for optimal performance. Kambix Innovations continues to drive innovation in the field, contributing to the advancement of microelectronics and the seamless integration of cutting-edge technologies.
About Kambix Innovations, LLC: Kambix Innovations, LLC is a pioneering technology company dedicated to pushing the boundaries of innovation in several technological areas including thermal management for microelectronic components, electronics cooling, and medical magnetothermal stimulation treatments for neurodegenerative conditions such as Parkinson’. Kambix Innovations strives to provide solutions that can enhance the performance and reliability of electronic systems in the face of evolving technological challenges.
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